Saturday, June 29, 2013

Top Semiconductor Stocks To Invest In 2014

Next Monday, Texas Instruments (NASDAQ: TXN  ) will release its latest quarterly results. The key to making smart investment decisions on stocks reporting earnings is to anticipate how they'll do before they announce results, leaving you fully prepared to respond quickly to whatever inevitable surprises arise.

As the maker of best calculators ever built, Texas Instruments holds a special place in the hearts of engineers, scientists, and financial analysts. But the company has gone well beyond simple calculating machines to build the semiconductor chips that have found their way into many of the most innovative and popular mobile devices in the tech market. Let's take an early look at what's been happening with Texas Instruments over the past quarter and what we're likely to see in its report.

Top Semiconductor Stocks To Invest In 2014: Micron Technology Inc.(MU)

Micron Technology, Inc., together with its subsidiaries, engages in the manufacture and marketing of semiconductor devices worldwide. Its products include dynamic random access memory (DRAM) products that provide data storage and retrieval, which include DDR2 and DDR3; and other specialty DRAM memory products, including DDR, SDRAM, DDR and DDR2 mobile low power DRAM, pseudo-static RAM, and reduced latency DRAM. The company also offers NAND flash memory products, which are electrically re-writeable and non-volatile semiconductor devices that retain content when power is turned off. In addition, it provides NOR flash memory products that are electrically re-writeable and non-volatile semiconductor memory devices; phase change memory products; and image sensor products. Micron Technology?s products are used in a range of electronic applications, including personal computers, workstations, network servers, mobile phones, flash memory cards, USB storage devices, digital still c ameras, MP3/4 players, and in automotive applications. It sells its products to original equipment manufacturers and retailers through internal sales force, independent sales representatives, and distributors, as well as through a Web-based customer direct sales channel. The company was founded in 1978 and is headquartered in Boise, Idaho.

Advisors' Opinion:
  • [By Fitz Gerald]  

    The company's management has indicated a positive and more-balanced DRAM and NAND flash demand/supply outlook for 2011. The company also indicated a more-resilient near-term business model with low exposure to the weak PC DRAM segment (25 percent of revenues).

    Micron also indicated strong demand for NAND flash and price reductions consistent with learning curve cost reductions. With many smartphone and iPad/new Web tablets ramping, Micron management expects the benign pricing environment for NAND flash to continue in 2012.

  • [By Jonas Elmerraji]

     We're seeing another bottoming pattern forming in shares of Micron Technology (MU). Like Microsoft, Micron has underperformed the broad market this year, barely breaking even between the first trading day of January and today. But a long-term double bottom formation in shares is a sign that shareholders could be getting a reprieve from selling very soon.

    A double bottom is a price pattern that's formed by two swing lows that bottom out at approximately the same price level. The two bottoms are separated by a peak that marks that resistance level for the setup -- a breakout above that price (right around $7 for MU) is the buy signal for shares. It's worth noting that resistance in Micron is actually tougher than just a single peak: that $7 barrier has been acting like strong resistance on the last five attempts higher. Believe it or not, that's actually a good thing because it means that a breakout above resistance carries more technical significance for MU.

    Remember that this is a long-term pattern -- it's been forming since all the way back in April, so its trading implications are bigger too. The breakout above $7 is likely to come with a long-term shift towards buyers being in control of this stock…

Top Semiconductor Stocks To Invest In 2014: Texas Instruments Incorporated(TXN)

Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.

Advisors' Opinion:
  • [By Paul Goodwin]  

    How do they make their money? TXN makes the PA Duplexer Module and the CDMA PA that goes into every iPhone. With a PEG ratio of 0.2 reveals huge discount compared to peers. This is a cash rich company and one I feel will be a strong performer within the next year.

Top 10 Gold Companies To Invest In 2014: Xilinx Inc (XLNX)

Xilinx, Inc. (Xilinx), incorporated on February 5, 1984, designs, develops and markets programmable platforms. These programmable platforms have a number of components, including integrated circuits (ICs) in the form of programmable logic devices (PLDs), including Extensible Processing Platforms (EPPs); software design tools to program the PLDs; targeted reference designs; printed circuit boards, and intellectual property (IP), which consists of Xilinx and various third-party verification and IP cores. In addition to its programmable platforms, Xilinx provides design services, customer training, field engineering and technical support. The Company�� PLDs include field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs) that its customers program to perform logic functions, and EPPs. Xilinx�� products are offered to electronic equipment manufacturers in end markets, such as wired and wireless communications, industrial, scientific and medical, aerospace and defense, audio, video and broadcast, consumer, automotive and data processing. The Company sells its products globally through independent domestic and foreign distributors and through direct sales to original equipment manufacturers (OEMs) by a network of independent sales representative firms and by a direct sales management organization. In January 2011, the Company acquired AutoESL Design Technologies, Inc. In August 2012, the Company acquired embedded Linux solutions provider PetaLogix.

Product Families

The 7 series devices that comprise the Company�� 28-nanometer (nm) product families are fabricated on a high-K metal gate 28-nm process technology. These devices are based on an architecture, which enables design and IP portability and re-use across all families, as well as provides designers the ability to achieve the appropriate combination of I/O support, performance, feature quantities, packaging and power consumption to address a range of applications. The 7 series devices consist of! three families: Virtex-7 FPGA, Kintex-7 FPGAs and Artix-7 FPGAs. The Zynq-7000 family is the family of Xilinx EPPs. The Virtex-6 FPGA family consists of 13 devices and is the sixth generation in the Virtex series of FPGAs.

Virtex-6 FPGAs are fabricated on a high-performance, 40-nm process technology. There are three Virtex-6 families: Virtex-6 LXT FPGAs, Virtex-6 SXT FPGAs and Virtex-6 HXT FPGAs. The Spartan-6 family is the PLD industry�� 45-nm high-volume FPGA family, consisting of 11 devices in two product families: Spartan-6 LX FPGAs and Spartan-6 LXT FPGAs. The Virtex-5 FPGA family consists of 26 devices in five product families: Virtex-5 LX FPGAs for logic-intensive designs, Virtex-5 LXT FPGAs for high-performance logic with serial connectivity, Virtex-5 SXT FPGAs for high-performance DSP with serial connectivity, Virtex-5 FXT FPGAs for embedded processing with serial connectivity and Virtex-5 TXT FPGAs for high-bandwidth serial connectivity. Prior generation Virtex families include Virtex-4, Virtex-II Pro, Virtex-II, Virtex-E and the original Virtex family. Spartan family FPGAs include 90-nm Spartan-3 FPGAs, the Spartan-3E family and the Spartan-3A family. Prior generation Spartan families include Spartan-IIE, Spartan-II, Spartan XL and the original Spartan family.

Design Platforms and Services

The Company offers three types of programmable platforms. The Base Platform is the delivery vehicle for all of its new silicon offerings used to develop and run customer-specific software applications and hardware designs. The Base Platform consists of FPGA silicon; Integrated Software Environment (ISE) Design Suite design environment; integration support of optional third-party synthesis, simulation, and signal integrity tools; reference designs; development boards and IP. The Domain-Specific Platform targets one of the three primary Xilinx FPGA user profiles: the embedded processing developer; the DSP developer; or the logic/connectivity developer. The Market-S! pecific P! latform enables software or hardware developers to build and run their specific application or solution. Built for specific markets, such as automotive, consumer, aerospace and defense, communications, audio, video and broadcast, industrial, or scientific and medical, the Market-Specific Platform integrates both the Base and Domain-Specific Platforms.

During April 2012, Xilinx introduced the Vivado Design Suite. Vivado supports Xilinx 7 series FPGAs and Zynq EPPs. Xilinx and various third parties offer hundreds of no charge and fee-bearing IP core licenses covering Ethernet, memory controllers Interlaken and PCIe interface, as well as domain-specific IP in the areas of embedded, DSP and connectivity, and market-specific IP cores. The Company also offers development kits, including hardware, design tools, IP and reference designs. Xilinx offers a range of configuration products, including one-time programmable and in-system programmable storage devices to configure Xilinx FPGAs. These programmable read-only memory (PROM) products support all of the Company�� FPGA devices. Xilinx and certain third parties have developed and offer a ecosystem of IP, boards, tools, services and support through the Xilinx alliance program. Xilinx also works with these third parties to promote its programmable platforms through third-party tools, IP, software, boards and design services. Xilinx engineering services provide customers with engineering, ranging from hands-on training to full design creation and implementation.

The Company competes with Altera Corporation, Lattice Semiconductor Corporation and Microsemi Corporation.

Top Semiconductor Stocks To Invest In 2014: Taiwan Semiconductor Manufacturing Co Ltd (TSM)

Taiwan Semiconductor Manufacturing Co., Ltd. is a Taiwan-based company principally engaged in the research, development, manufacture and distribution of integrated circuit (IC) related products. The Company operates its businesses through wafer manufacture, mask production, wafer testing and packaging components. The Company also involves in the provision of production management, customer services and design services. Its products and services are applied in the manufacture of personal computers and peripheral products, information related products, wire and wireless communication systems, automobile and industrial equipment, as well as consumer electronic products, such as digital disk players, digital televisions (TVs), game consoles, digital cameras, among others. Its customers include Altera, AMD, Broadcom, Marvell, NVIDIA, Qualcomm, Analog Devices, Freescale, NXP and Texas Instruments, among others. In July 2010, Taiwan Semiconductor Manufacturing Co. acquired mechanical and engineering equipment from ASML HONG KONG LTD. In September 2010, the Company acquired a set of equipments from ASML HONG KONG LTD. In December 2010, the Company acquired a set of equipment from TOKYO ELECTRON LTD., KLA-TENCOR CORP. and NOVELLUS SYSTEMS INTERNATIONAL,B.V. In January 2011, the Company announced that it had acquired a set of equipment from KLA-TENCOR CORP., a set of equipment and facility, and another set of equipment from VARIAN SEMI. EQUIP. ASSOCIATES GmbH. In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc.In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc. In May 2011, it acquired a set of equipments form APPLIED MATERIALS SOUTH EAST ASIA PACIFIC LTD., Hamatech APE Gmbh and CO. KG, TOKYO ELECTRON LTD., DAINIPPON SCREEN MFG. CO., LTD., and VARIAN SEMI. EQUIP. ASSOCIATES GMBH.

TSMC's customers include semiconductor companies, ranging from fabless semiconductor and systems companies, such as Advanced Micro Devices, In! c., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., nVidia Corporation and Qualcomm Incorporated, to integrated device manufacturers, such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of its net sales as of December 31, 2009.

The Company manufactures semiconductors using CMOS and BiCMOS processes. The BiCMOS process combines the speed of the bipolar circuitry and the power consumption and density of the CMOS circuitry. It uses the CMOS process to manufacture logic semiconductors, memory semiconductors, including static random access memory (SRAM), flash memory, mixed-signal/ radio frequency (RF) semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system (MEMS), which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors.

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